學手機PCB佈線
上传用户：zhuanjifen
上传日期：2013-09-22
文件类型：PDF
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手機布線要求BB/RF/layout Training Session
Gary Hsu
Bientec
Typical PCB structure (1/3)
4 20 4 16 8 16 8
L1 L2
20 8 12 4 8 8 4 18
L3
12
Ln-2
24 5 12
Ln-1 Ln N>=8
24
18
12
Unit: mil
2
Bientec
Typical PCB structure (2/3)
Multi-Layer Structure
6 860um +/-10%
Number of layers: Total thickness (measured on solder resist):
Layer 1 copper thickness----------------------------------------------------0.7mil Epoxy 1 thickness (rcc)------------------------------------------------------2.0mil Layer 2 copper thickness----------------------------------------------------1.4mil Epoxy 2 thickness (Prepreg FR4)--------( 1080 x 2 ) ---------------5.5mil Layer 3 copper thickness----------------------------------------------------1.4mil Epoxy 3 thickness (Core FR4)----------------------------------------
Gary Hsu
Bientec
Typical PCB structure (1/3)
4 20 4 16 8 16 8
L1 L2
20 8 12 4 8 8 4 18
L3
12
Ln-2
24 5 12
Ln-1 Ln N>=8
24
18
12
Unit: mil
2
Bientec
Typical PCB structure (2/3)
Multi-Layer Structure
6 860um +/-10%
Number of layers: Total thickness (measured on solder resist):
Layer 1 copper thickness----------------------------------------------------0.7mil Epoxy 1 thickness (rcc)------------------------------------------------------2.0mil Layer 2 copper thickness----------------------------------------------------1.4mil Epoxy 2 thickness (Prepreg FR4)--------( 1080 x 2 ) ---------------5.5mil Layer 3 copper thickness----------------------------------------------------1.4mil Epoxy 3 thickness (Core FR4)----------------------------------------
关键词： 手機 布線 要求
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