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One/Two Instruction(s) Executed per Cycle

Dual Multipliers [Up to 200 Million Multiply-Accumulates per Second (MMACS)]

Two Arithmetic/Logic Units (ALUs)

Three Internal Data/Operand Read Buses and Two Internal Data/Operand Write Buses

Fully Software-Compatible With C55x Devices

Industrial Temperature Devices Available

320K Bytes Zero-Wait State On-Chip RAM, Composed of:

64K Bytes of Dual-Access RAM (DARAM), 8 Blocks of 4K x 16-Bit

256K Bytes of Single-Access RAM (SARAM), 32 Blocks of 4K x 16-Bit

128K Bytes of Zero Wait-State On-Chip ROM (4 Blocks of 16K x 16-Bit)

16-/8-Bit External Memory Interface (EMIF) with Glueless Interface to:

8-/16-Bit NAND Flash, 1- and 4-Bit ECC

8-/16-Bit NOR Flash

Asynchronous Static RAM (SRAM)

Direct Memory Access (DMA) Controller Four DMA With 4 Channels Each (16-Channels Total)

Three 32-Bit General-Purpose Timers

One Selectable as a Watchdog and/or GP

Two MultiMedia Card/Secure Digital (MMC/SD) Interfaces

Universal Asynchronous Receiver/Transmitter (UART)

Serial-Port Interface (SPI) With Four Chip-Selects

Master/Slave Inter-Integrated Circuit (I2C Bus?)

Four Inter-IC Sound (I2S Bus?) for Data Transport

Device USB Port With Integrated 2.0 High-Speed PHY that Supports: USB 2.0 Full- and High-Speed Device

LCD Bridge With Asynchronous Interface

Tightly-Coupled FFT Hardware Accelerator

10-Bit 4-Input Successive Approximation (SAR) ADC

Real-Time Clock (RTC) With Crystal Input, With Separate Clock Domain, Separate Power Supply

Four Core Isolated Power Supply Domains: Analog, RTC, CPU and Peripherals, and USB

Four I/O Isolated Power Supply Domains: RTC I/O, EMIF I/O, USB PHY, and DVDDIO

Low-Power S/W Programmable Phase-Locked Loop (PLL) Clock Generator

On-Chip ROM Bootloader (RBL) to Boot From NAND Flash, NOR Flash, SPI EEPROM, or I2C EEPROM

IEEE-1149.1 (JTAG?) Boundary-Scan-Compatible

Up to 26 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)

196-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZCH Suffix)

1.05-V Core (60 MHz), 1.8-V, 2.5-V, 2.8-V, or 3.3-V I/Os

1.3-V Core (100 MHz), 1.8-V, 2.5-V, 2.8-V, or 3.3-V I/Os

TMS320VC5505应用:

Wireless Audio Devices (e.g., Headsets, Microphones, Speakerphones, etc.)

Echo Cancellation Headphones

Portable Medical Devices

Voice Applications

Industrial Controls

Fingerprint Biometrics

Software Defined Radio

图2.TMS320VC5505功能方框图

A number of emerging medical applications such as electrocardiography (ECG), digital stethoscope, and pulse oximeters require DSP processing performance at very low power. The TMS320VC5505 digital signal processor (DSP) is ideally suited for such applications. The VC5505 is a member of TIs C5000? fixed-point DSP platform. To enable the development of a broad range of medical applications on the VC5505, Texas Instruments has developed an MDK based on the VC5505 DSP. A typical medical application includes:

An analog front end, including sensors to pick up signals of interest from the body

Signal processing algorithms for signal conditioning, performing measurements and running analytics on measurements to determine the health condition

User control and interaction, including graphical display of the signal processing results and connectivity to enable remote patient monitoring

The MDK is designed to support complete medical applications development. It includes the following elements:

Analog front-end boards (FE boards) specific to the key target medical applications of the VC5505 (ECG, digital stethoscope, pulse oximeter), highlighting the use of the TI analog components for medical applications

VC5505 DSP evaluation module (EVM) main board

Medical applications software including example demonstrations Several elements of the MDK pulse oximeter system are:

VC5505 EVM

Pulse oximeter front-end board

Finger probe sensor

The schematics for the ECG front-end board

图3. ECG前端板电路图(1)

图4. ECG前端板电路图(2): ECG电极:V1 V2 V3

关键词： ECG TMS